Murata F-40 Bedienungsanleitung

Silicon ESD protection device LXESxxB seriesDocument No. LX–1-1122Rev1.0p1/301. Application This specification shall be applied to the

p10/30MURATA MFG. CO., LTD.(4) SOT23-6L4 - 4 - 1 DIMENSIONS4 - 4 - 2 Pin Configuration4 - 4 - 3 Circuit Diagramsymbol size symbol sizeL 2.9 typ c (1.9

p11/30MURATA MFG. CO., LTD.(5) SOT23-5L4 - 5 - 1 DIMENSIONS 4 - 5

p12/30MURATA MFG. CO., LTD.(6) DFN2510P10E4 - 6 - 1 DIMENSIONS Top View Bottom View

p13/30MURATA MFG. CO., LTD.(7) MSOP-8L4 - 7 - 1 DIMENSIONS Top View Side View 1

p14/30MURATA MFG. CO., LTD.5. Reliability TestNo. Items Specifications Test Methods NumberResult(Fail)1 Vibration Resistance No severe damagesSatisfy

p15/30MURATA MFG. CO., LTD.No. Items Specifications Test Methods NumberResult (Fail)7 High Temp.ExposureAppearanceElectricalSpecificationsNo severe da

p16/30MURATA MFG. CO., LTD.Fig. 1 Land PatternPackage : DFN1006P2E , DFN1006P2XUnit : mm※Reference purpose only.Package : QFN1616P6E

p17/30MURATA MFG. CO., LTD.Package : SOT23-6L Unit : mm

p18/30MURATA MFG. CO., LTD.Package : MSOP-8L Unit : mm※Reference purpose only.0

p19/30MURATA MFG. CO., LTD.Fig. 2 Testing boardMounted situation

p2/30MURATA MFG. CO., LTD.3. CHARACTERISTICS3-1 RatingsParameter PackageOperating TemperatureStorageTemperatureSymbol TOPTSTOUnit0C0CLXES1UBAB1-007 DF

p20/30MURATA MFG. CO., LTD.6.Tape and Reel Packing(1) Dimensions of Tape (Plastic tape)Not in scale U

p21/30MURATA MFG. CO., LTD.(2) Dimensions of Tape (Plastic tape)

p22/30MURATA MFG. CO., LTD.(3) Dimensions of Reel

p23/30MURATA MFG. CO., LTD.(5) Taping Diagrams[1] Feeding Hole : As specified in (1),(2)[2] Hole for chip : As specified in (1),(2)[3] Cover tap

p24/30MURATA MFG. CO., LTD. LXES2SBAA4-016/LXES2SBBB4-026 LXES4XBAA6-027/ LXES2TBCC4-02

p25/30MURATA MFG. CO., LTD.(6) Leader and Tail tape(7) The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pull

p26/30MURATA MFG. CO., LTD.NOTICE１．Storage Conditions:・The product shall be stored without opening the packing under the ambient temperature

p27/30MURATA MFG. CO., LTD.5. Soldering Conditions:Carefully perform preheating so that the temperature difference (T) between the solder and product

p28/30MURATA MFG. CO., LTD.Amount of Solder Paste:- Ensure that solder is applied smoothly to a minimum height of 0.2 to 0.5 mm at the end surface of

p29/30MURATA MFG. CO., LTD.6. Cleaning Conditions:Any cleaning is not permitted.7. Operational Environment Conditions:Products are designed to work

p3/30MURATA MFG. CO., LTD.ParameterReverseW orkingVoltageChannel Leakage CurrentBreak down voltageESD per IEC 61000-4-2(air)ESD per IEC 61000-4-2(cont

p30/30MURATA MFG. CO., LTD.!Note:Please make sure that your product has been evaluated and confirmed against your specifications when our product is m

p4/30MURATA MFG. CO., LTD.3-3 Typical CharacteristicsLXES1UBAB1-007 ESD Waveform(IEC61000-4-2：8kV Contact) Voltage－Capacit

p5/30MURATA MFG. CO., LTD.LXES1TBBB2-013 ESD Waveform(IEC61000-4-2：8kV Contact) Voltage－Capacitance CharacteristicLXES2S

p6/30MURATA MFG. CO., LTD.LXES2SBAA4-114 ESD Waveform(IEC61000-4-2：8kV Contact) Voltage－Capacitance Characteristic

p7/30MURATA MFG. CO., LTD.4. CONSTRUCTION, DIMENSIONS(1) DFN1006P2E4 - 1 -1 DIMENSIONS

p8/30MURATA MFG. CO., LTD.(2) DFN1006P2X4 - 2 - 1 DIMENSIONSTop View Bottom View

p9/30MURATA MFG. CO., LTD.(3) QFN1616P6E4 - 3 - 1 DIMENSIONS Top View